Abstract
As we enter era of “intelligence”, an increasing number of smart devices are being equipped around us. Such devices reflect the emerging need in microelectronics industry: increased functionality and miniaturization. As Moore’s law gradually meets its bottleneck, the concept of “More-than-Moore” (MtM) is proposed to address this issue by migrating board level system assembly to package level system integration. System in package (SiP) technology emerges as a promising solution for increasing the level of integration. Together with other novel packaging technologies, such as wafer level packaging (WLP), SiP shows great potential for providing intensely integrated functional system with miniaturized form factor. This thesis aims to develop novel SiP design and implement it into intelligent applications such as solid state lighting (SSL) and particulate matter (PM) sensor.
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