Abstract

AbstractAlthough epoxy resin (EP) has been widely used in many fields, it is still urgent to effectively improve its flame retardancy by halogen‐free strategies. Herein, a silicon‐containing cyclotriphosphazene derivative (HEP‐Si) was synthesized by nucleophilic substitution and silicon–hydrogen addition reaction using eugenol, hexachlorophosphazene and triethylsilane as raw materials. Then it served as a halogen‐free flame retardant for an EP/4,4′‐diaminodiphenylmethane system, and its performance was compared with that of commercial flame retardant hexaphenoxycyclotriphosphazene (HPP). The results showed that although the initial thermal decomposition temperature (T5%) of the cured products of EP/HEP‐Si was slightly lower than that of pure EP, T5% did not decrease further as the amount of HEP‐Si increased, indicating that good thermal stability was maintained. In addition, the char yield of the cured products of EP/HEP‐Si was significantly increased (more than 20 wt%) compared to that of pure EP. The cured EP with the addition of HPP and HEP‐Si both achieved a V‐0 rating in UL‐94 vertical burning test at 0.5 wt% phosphorus content, while the limiting oxygen index of the EP/HEP‐Si system was higher, reaching 33.2%. From cone calorimetric test results, the peak heat release rate, total heat release and total smoke production of the cured products of EP/HEP‐Si decreased by 61.5%, 37.1% and 26.2%, respectively, compared with that of pure EP. The cured EP/HEP‐Si materials also exhibited good thermomechanical and mechanical properties. Therefore, HEP‐Si is suggested to be a promising P/N/Si‐containing halogen‐free flame retardant for EP. © 2024 Society of Industrial Chemistry.

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