Abstract
A new bis(amino)-functionalized POSS monomer was prepared and characterized with the formula diexo-(c-C5H9)8Si8O11(p-C6H4NH2)2 . The new POSS monomer (1−10 mol %) along with diamines 1,3-bis(3-aminophenoxy)benzene (APB) and 3,4‘-oxydianiline (ODA) and were copolymerized with 4,4‘-oxydiphthalic anhydride (ODPA) and two reactive end-caps, 4-(arylethynyl)phthalic anhydride {where aryl = phenyl and 9-anthracenyl} to afford a series of new inorganic/organic imide oligomers. The oligomers containing 1% and 10% POSS gave similar Tg data (≈191 and 203 °C) as the pure organic imide oligomers and were shown to thermally cure to afford solvent-resistant and high Tg resins. The thermal curing kinetic data for the 10%-POSS-containing imide was obtained. The kinetic data showed the rate of thermal curing to be unaffected (within experimental deviation) by the addition of the POSS units.
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