Phenylethynylnaphthalic endcapped imide oligomers with reduced cure temperatures

Abstract

A series of 4-(2-phenylethynyl)-1,8-naphthalic anhydride (PENA) endcapped imide oligomers with different chemical backbones and calculated number average molecular weights (Calc’d M n) were successfully synthesized and characterized. The PENA-endcapped imide oligomers were mixtures of mono- and double-endcapped imide oligomers with polymerization degree ( P n) of 1–5 and number average molecular weights ( M n) of 2515–3851 g/mol. determined by GPC. Study on effect of chemical structures on the curing behaviors of two model compounds: PENA-m based on PENA and PEPA-m derived from 4-phenylethynylphthalic anhydride (PEPA) revealed that PENA-m showed the cure temperature of 50 °C lower than PEPA-m and the activity energy of thermal curing reaction for PENA-m was also lower than that of PEPA-m. The PENA-endcapped imide oligomers could be melt at temperatures of >250 °C with the minimum melt viscosity of 1.2–230 Pa s at 275–301 °C and the widen melt processing windows, along with 10–40 °C lower cure temperature than the PEPA-endcapped analogue.The PENA-endcapped imide oligomers could be thermally cured at 350 °C/1 h to afford the thermally cured polyimides with good combined thermal and mechanical properties including T g of 344–397 °C (DMA), T d of 443–513 °C, tensile strength of as high as 54.7 MPa, flexural strength of as high as 126.1 MPa and modulus of as high as 2.3 GPa, respectively.