Abstract
AbstractOptically clear silicone/epoxy hybrid resins were synthesized. The silicone resin (SiR) carrying SiH, SiCHCH2 and SiOH groups was prepared by hydrolytic condensation. The blends of SiR and diglycidyl ether of hydrogenated bisphenol A (DGEHBA) were cured through platinum‐catalyzed hydrosilylation and aluminium acetylacetonate‐catalyzed polymerization. The curing process was studied using differential scanning calorimetry and rigid‐body pendulum rheometry. It was found that the ratio of SiR to DGEHBA plays a major role in the curing process. The SiOH groups of SiR assist polymerization of DGEHBA, and react with the epoxy resin to prevent phase separation. The cured hybrid resins are single‐phase materials with a transmittance of about 87% at 400 nm for a thickness of 3 mm using air as reference. UV resistance and thermal stability of the hybrids are largely dependent on the composition. The adhesive strength of the SiRs can be significantly improved by a small fraction of DGEHBA, with a marginal influence on UV resistance. However, increasing the epoxy proportion has a marked negative influence on thermal stability. Compounding stabilizers, especially thermal stabilizers, are essential, in particular for high epoxy content, if the hybrids are to be used for high‐brightness light‐emitting diode packaging. Copyright © 2011 Society of Chemical Industry
Published Version
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