Abstract
Cu-Ni films are electrodeposited at a cathodic current of 10 mA via galvanostatic mode on ITO-coated glass substrates. It found by X-ray diffraction that the films crystalized into fcc structure with the highest intensity corresponding to (111) plane at a two-theta value of 43°. The presence of binding energy peaks at 856.57 eV, 861 eV, 933 eV, and 952 eV observed in X-ray photoelectron spectroscopy have confirmed the presence of nickel oxide/hydroxide and copper oxide/hydroxide, respectively. Tafel polarization studies conducted in 3.5 wt. % sodium chloride solution shows the shifts in Ecorr towards the positive side and decrease of Icorr with the passage of exposure time is attributed to the formation of protective oxides/hydroxides layers of Cu and Ni elements in the films.
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