Abstract

Silicon Carbide (SiC), typically 4H-SiC, is replacing conventional silicon materials for high power and high frequency applications due to its excellent electrical and thermal properties [1]. However, high quality SiC wafers with low defect density are still in urgent need for automotive and energy saving applications. SiC wafers are obtained from bulk growth by physical vapor transport (PVT) method and considerable efforts have been expended to optimize growth process to lower defect densities. One major approach is the study of initial stages of crystal growth as most defects are nucleated at this stage and propagate into the boule. Ailihumaer et al [2] demonstrated the behaviors of threading edge dislocations (TEDs), threading screw dislocations (TSDs)/threading mixed dislocations (TMDs), and basal plane dislocations (BPDs) across the seed/newly grown layer interface in PVT-grown 4H-SiC. Sanchez et al [3] revealed the nucleation of TEDs and TSDs at the initial growth stage in PVT-grown SiC.However, more detailed investigations are still in demand for PVT grown 4H-SiC crystals during initial stage of growth. This study investigates 4° off-axis 4H-SiC wafers with several hundred microns of initial-stage growth PVT method. Synchrotron X-ray topography (SXRT) technique is employed and shows dramatically modified defect distribution across the seed/newly grown layer interface (Figure 1). The formation of Shockley stacking fault starting at initial stage of crystal growth is suggested as partial dislocations running along <11-20> directions on basal plane are observed to form rhombus shapes (Figure 2). Prismatic slip is observed to take place near the wafer edges and prismatic dislocations undergo cross slip to form unique dislocation configurations. A statistical analysis on defect changes across the seed/newly grown layer is being carried out and the results will be reported. These results will be complemented by observations from Nomarski optical microscopy (NOM) and Raman Spectroscopy studies to propose the formation mechanism of defects across the seed/newly grown layers.

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