Abstract

In recent years, 4H-SiC has become a widely acknowledged material applied in high power electronics. 4H-SiC-based devices are able to operate at high voltage, high current and high temperature due to its superior physical properties. However, they have yet to reached to the requirements for mass production, due to the fact of SiC’s relatively inferior crystal quality. Over the past few decades, the effect of various dislocations existing in the crystals such as threading screw/mixed dislocations (TSD/TMDs), threading edge dislocations (TEDs) and basal plane dislocations (BPDs) has been studied and revealed to be main source for degrading the reliability of SiC power devices[1-2]. Recently, studies on the early stages of physical vapor transport (PVT) growth of SiC have been reported by several groups regarding to the investigation of the step morphology and lattice plane bending [3-5]. However, dislocation propagation behavior and their formation mechanism at the early growth stages are yet to be studied in detail.This paper describes the investigation of dislocation behavior during the early stages of PVT-grown 6-inch 4H-SiC crystals by synchrotron monochromatic beam x-ray topography (SMBXT) technique. Ray tracing simulation was applied to simulate the dislocation images. Our studies show that most of the TSDs/TMDs are replicated into the newly grown crystal while most TEDs are generated by either nucleation in pairs at the seed/crystal interface or by redirection of BPDs in the seed crystal. Most BPDs in the newly grown layer are of screw type with 1/3[11-20] and this has been verified by comparison with ray tracing simulated images. TEDs with the same and opposite sign of Burgers vector are found to be deflected on to same basal plane by the overgrowth of macro-steps and start to glide in the same and opposite directions respectively. TMDs deflected on to the basal plane by macro-steps get dissociated into c and a components, with the a segment undergoing glide to form V-shaped configurations.[1] St.G. Muller, J.J. Sumakeris, M.F. Brady, R.C. Glass, H.M. Hobgood, J.R. Jenny, R. Leonard, D.P. Malta, M.J. Paisley, A.R. Powell, V.F. Tsvetkov, S.T. Allen, M.K. Das, J.W. Palmour, and C.H. Carter. Jr., Eur. Phys. J. Appl. Phys. 27, 29 (2004).[2] R. Singh and M. Pecht, IEEE Ind Electron M 2, 19 (2008).[3] E.K. Sanchez, J.Q. Lin, M.De. Graef, M. Skowronski, W.M. Vetter, M. Dudley, J. Appl. Phys. 91 (3) (2002) 1143.[4] C. Ohshige, T. Takahashi, N. Ohtani, M. Katsuno, T. Fujimoto, S. Sato, H. Tsuge, T. Yano, H. Matsuhata, M. Kitabatake, J. Cryst. Growth 1-6, 408 (2014).[5] N. Ohtani, C. Ohshige, M. Katsuno, T. Fujimoto, S. Sato, H. Tsuge, W. Ohashi, T. Yano, H. Matsuhata, M. Kitabatake, J. Cryst. Growth 9-15, 386 (2014). Figure 1

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