Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique

Abstract

UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the sidewalls of the electroformed structure. This study is beneficial to optimizing microfluidic chip mold design.