Abstract

Hot embossing (HE) is a micro-fabrication technique employed to create micron-scale patterns on the polymer substrate. An in-house induction-assisted hot embossing (IHE) setup was fabricated to complete the embossing in a short duration as compared to traditional hot embossing process. This work alters the polymer surface topography to make it superhydrophobic for self-cleaning. Fiber laser machining was used to produce four-microchannel designs on an Aluminum-6061 plate in which the microchannel width was varied from 600 μm to 150 μm while maintaining a constant adjacent distance of 300 μm. This textured plate is employed as a mold in the IHE setup. IHE process parameters, embossing temperature, pressure, time, and deembossing temperature were varied to emboss the mold designs on a polyethylene terephthalate substrate. Thereafter, the embossed microchannel height, surface roughness, and water contact angle perpendicular to the embossed microchannels (WCA⟂) were calculated. The parametric analysis examined how operational factors affected the output. The experiment was done as per the central composite design (experimental design) part of the design-of-experiments useful in the response surface model. Parametric research demonstrates that embossed microchannel height and width had a maximum effect on WCA⟂. Type-IV microchannels with 150 μm width demonstrated the highest WCA⟂. The WCA⟂ was mostly impacted by embossed microchannel height; hence a regression model was created using type-IV channel height data. Analysis of variance showed that embossing temperature mainly impacts microchannel height. The recently invented Jaya-algorithm optimized this model to increase embossed microchannel height and WCA⟂. Setting the parameters at the best level predicted by Jaya-algorithm yielded an embossed microchannel height inaccuracy of 2.18%. The WCA⟂ measured on the surface of a sample prepared at the best parameters was found to be 154.71° 2°. Lastly, FTIR (Fourier-transform-infrared-spectroscopy) test showed no chemical composition change between the embossed and bare samples.

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