Abstract
Polymeric structural components used in the electronic industry require electromagnetic interference shielding which can be provided by copper, overplated by nickel for corrosion protection. This paper discusses what effects field environments have on electroless nickel over copper plated polycarbonate components when subjected to degradation by accelerated corrosion testing, specifically to the class II Battelle flowing mixed gas environment. Surface chemical changes have been studied ex situ using scanning Auger microscopy and x-ray photoelectron spectroscopy. Changes include the formation of copper sulfide, cuprous oxide, and nickel oxide. Corrosion of copper can be attributed to imperfections (i.e., thin spots, mud cracks, and pinholes) in the nickel film and/or its migration through the nickel layer when subjected to the accelerated corrosion test conditions.
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