Abstract
This paper presents the results of the surface properties of the tin-based melts. It has been shown that the best wetting of Al-4 at. % Li grade aluminum, silicon, and piezoceramics are achieved by the eutectics and terectics of tin-aluminum, tin-zinc, and aluminum alloys, respectively. Preliminary photon annealing of the substrates for 3–4 sec improves the wetting of silicon and ceramics. Solder wetting is also improved by the addition of copper and nickel micro powders, alkaline, and alkaline earth elements.
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Schedule a callMore From: IOP Conf. Series: Materials Science and Engineering
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