Abstract
Surface plasmon waveguide devices were fabricated in symmetric Cytop claddings by bonding the claddings with Au waveguides and microfluidic channels at the interface. Au features were patterned and deposited on the bottom wafer and microfluidic channels were patterned and etched into the top wafer. Aligned wafer bonding and annealing were performed at temperatures slightly above the glass transition temperature (Tg) of Cytop. The bond strength is high, allowing dicing, ultrasonic cleaning, and polishing of facets. The bond is also of good hermiticity as assessed by fluid injection, and of reasonable optical quality as verified by measurements of long-range surface plasmon propagation at λ = 1310 and 1550 nm.
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Schedule a callMore From: Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
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