Abstract

The motivation for this contribution is the search for thin-film silicon oxycarbide (SiOC) materials suitable for modern electronics with good chemical/thermal stability, good barrier properties and conformal coverage, which can be deposited on rigid and flexible substrates, and whose surface can be organically functionalized. Two types of thin SiOC films of very different nature, such as polymer-like and ceramic-like, were fabricated by means of remote hydrogen microwave plasma chemical vapour deposition (RP-CVD) from 1,1,3,3–tetramethyldisiloxane (TMDSO). The RP-CVD coatings deposited on a silicon substrate were then modified by treatment with a direct radiofrequency (RF) plasma process induced in a mixture of argon and water vapour (Ar/H2O), which resulted in the surface activation through the formation of highly reactive silanol groups (SiOH). In this process a silicon oxide layer (SiOx) was also formed, and its growth was examined by FTIR, XPS and ellipsometry. The growth of the SiOx structure reduces the film thickness of silicon oxycarbide. Activation of the film surface is completed in <10 s. In the next modification step, the RP-CVD films were silanized by immobilizing (3-aminopropyl)triethoxysilane (APTES). Attachment of APTES molecules to the activated surface of SiOC films was observed with the development of an additional layer of SiOx on the surface. The silanization with APTES vapour under nitrogen allowed the formation of 10 nm-thick condensate. The AFM microscopic examination showed that the deposited APTES layers are homogeneous without aggregates specific for conventional silanization from the solution. The final modification of RP-CVD films was achieved by functionalization with an organic fluorescent probe, which involves the covalent attachment of pyrene to amino group of APTES using hydroxyimide ester linkage (PyNHS). The results of the present study proved that the chemical functionalization of thin silicon oxycarbide films was achieved.

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