Abstract
Bismuth telluride (Bi2Te3) and antimony telluride (Sb2Te3) thin films are successfully deposited on stainless steel (SS) substrate by the potentiostatic mode of electrodeposition. Herein, the focus is on surface deformation during the electrodeposition process under the effect of deposition time. This study is carried out using double‐exposure digital holographic interferometry (DEDHI) technique and the prepared optimized films are characterized for their physico‐chemical properties. The deposition potential is found out by cyclic voltammetry; it is −170 and −260 mV for Bi2Te3 and Sb2Te3, respectively. The hologram fringes are recorded during the electrodeposition of films and the variations in the number of fringes, deposited mass, thickness of film, and stress to surface with respect to deposition time are studied.
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