Abstract
During service, solder joints may encounter repeated reversed stress states. Since realistic solder joint specimen geometry employed for creep/stress relaxation studies does not facilitate stress reversal, shear test specimens consisting of 3/8″×3/8″×1″ copper blocks joined with eutectic Sn–Ag solder of realistic thickness of about 400 μm were used for this study. The mechanical behavior and microstructural features of the solder joint subjected to repeated reversed straining were investigated by imposing large shear strains. Damage accumulation on the surface of the solder joints due to a few such large shear strain reversals is very similar to that observed on the surface of thermomechanically fatigued joints made with the same solder.
Published Version
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