Abstract

Gold metallization of 3D printed polymer structures was conducted by a supercritical carbon dioxide (sc-CO2) assisted electroless plating process. Precursor of the Pd catalyst utilized in this study was palladium bis-hexafluoroacetylacetonate for the high solubility in sc-CO2. A Ni–P layer was first formed on the catalyzed polymer structure as a sacrificial layer for the sequential gold deposition. Electrical resistance of the gold metallized 3D printed structure was 0.15 Ω and slightly increased to 0.18 Ω after a tape adhesion test. The fracture strength was 47.6 MPa for the sample with 45 min of the gold deposition time.Graphical abstract

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call