Superconducting tunnel junction fabrication on three-dimensional topography based on direct laser writing

Abstract

Superconducting junctions are widely used in a multitude of applications ranging from quantum information science and sensing to solid-state cooling. Traditionally, such devices must be fabricated on flat substrates using standard lithographic techniques. In this study, we demonstrate a highly versatile method that allows for superconducting junctions to be fabricated on a more complex topography. It is based on maskless direct laser writing and two-photon lithography, which allows writing in 3D space. We show that high-quality normal metal–insulator–superconductor tunnel junctions can be fabricated on top of a 20-μm-tall three-dimensional topography. Combined with conformal resist coating methods, this technique could allow sub-micron device fabrication on almost any type of topography in the future.