Abstract
The data base for thermal expansion, elastic constants, compressive and tensile failure strengths and secondary thermal creep of leading solid-breeder (Li/sub 2/O, Li/sub 4/SiO/sub 4/, and LiAlO/sub 2/) and multiplier (Be) materials is reviewed, porosity, grain size, and stress (for thermal creep). Because the data base is rather sparse in some areas, general properties of ceramics and metals are used to help guide the formulation of the correlations. The primary purpose of the data base summary and correlation development is to pave the way for stress analysis sensitivity studies. These studies will help determine which properties are important enough to structural lifetime and deformation assessments to require more data. 18 refs., 5 figs., 20 tabs.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
