Abstract

The data base for thermal expansion, elastic constants, compressive and tensile failure strength, and secondary thermal creep of leading solid-breeder (Li/sub 2/O, Li/sub 4/SiO/sub 4/, and LiAlO/sub 2/) and multiplier (Be) materials is reviewed. Correlations for these properties are presented as a function of temperature, porosity, grain size, and stress (for thermal creep). Several stress analysis problems are then solved to assess whether the materials are likely to crack during operation and whether the breeder/multiplier materials are ''soft'' relative to structural materials after contact has been achieved. The primary purpose of the data base assessment and the stress analysis is to determine which properties have a significant impact on blanket lifetime and whether or not more data are needed for these properties. 18 refs., 4 figs., 1 tab.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call