Sub-surface damage layer of microchannel plate in optical processing

Abstract

Cracks in microchannel plate (MCP) seriously reduce the mechanical and electrical properties of MCP. The generation mechanism of cracks and the structure of sub-surface damage layer were revealed by studying the changes of surface morphology of MCP in optical process and chemical treatment process. The source of cracks appeared in the etching and reduction process is the sub-surface damage layer in the optical process. The damage layer includes cracks and non-uniform strain layer. After slicing, the depth of damage layer visible to optical microscope is within 25μm. During the polishing process, the damage layer is deeper, and there is a non-uniform strain layer with the depth of about 20μm. To avoid the occurrence of cracks, the thickness setting in the slicing process should take into account the slice damage layer, the polishing crack growth layer, and the strain layer.