Abstract
A simple process for forming sub-micron gaps between horizontal and vertical electrodes in a three-dimensional micro-electrode system without the need for high-resolution lithography is described. The process is based on the enhancement of ion milling rates in metals at oblique ion incidence, which allows the preferential erosion of metal at a mesa edge. Self-aligned electrode structures are formed on silica and oxidised silicon mesas, and electrode separations of 150–300 nm are demonstrated in geometries that may be suitable for vertical knife-edge field emission sources.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
