Abstract
A pressure-assisted sinter-bonding technique in air using modified Cu dendritic particles is suggested to obtain a high-temperature sustainable bondline for wide band-gap power devices. The combination of void filling by the bending deformation of stems in the dendritic particles, prompt sintering of nanonodules on the surfaces of the particles, and generation of fresh Cu by in situ reduction on surfaces of the particles exhibited extremely rapid sinter bonding. A die attached under 10 MPa for 10 s at 300 °C and under 5 MPa for 60 s at 350 °C demonstrated shear strength of 26.2 and 20.6 MPa, respectively, surpassing that of a die attached using Pb–5Sn.
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