Abstract
ABSTRACTTo develop thermally conductive PA6 composites with the aim of decreasing filler content, structure‐complexed fillers were fabricated. This research presented an effective approach by noncovalent functionalization of poly(dopamine) (PDA) followed by silver nanoparticles decoration to fabricate 3‐dimensional (3‐D) structured boron nitride hybrids (BN@PDA@AgNPs). BN hybrids were then introduced into PA6 to prepare thermally conductive PA6 composites. The results demonstrated that PA6/BN hybrids (PMB) composites exhibited higher thermal conducivity compared with PA6/BN composites, which revealed more effective construction of thermal conductive network in the composites with the addition of 3‐D structured fillers. The effects of BN hybrids with different loadings on thermal stability, mechanical property, as well as electrical resistance of the composites were also analyzed. Overall, the prepared PMB composites exhibited outstanding performance in thermal conductivity, thermal stability, mechanical property, while retaining good electrical insulating property, which showed a potential application in electronic packaging fields. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47630.
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