Study on the Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive

Guanghua Wu,Meixian Jiang

doi:10.1109/access.2019.2956648

Abstract

Interfacial residual stress resulting from coefficient of thermal expansion mismatch between different layers of the flip-chip joint is induced during the bonding process. The flip-chip joints suffer residual stresses that may cause cracking or delamination, which is one of the major reliability issues in electronic packaging. This paper theoretically analyzes the interfacial residual stress of the flip-chip joint based on anisotropic conductive adhesive (ACA). The residual stress model is established based on refined zigzag theory (RZT). Results show that the theoretical model and the simulation analysis are consistent. It is found that the interfacial thermal residual stress in the ACA layer is uneven and reaches its peak at the end of the bump. The RZT model is validated by experiments, and the model prediction agrees well with the test results.

Highlights

Flip-chip bonding based on anisotropic conductive adhesive (ACA) has many advantages and is popular in many electronic packaging interconnect products, such as radio frequency identification (RFID), liquid crystal displays (LCDs), and flexible electronics [1]–[3]
This paper focuses on the interfacial residual shear stress of the ACA layer τ (3)(x), as shown in Equations (3) to (6)
In order to compare with the theoretical model, Abaqus Finite Element simulation software was used to simulate the interfacial residual stress of the flip-chip joint

Summary

Introduction

Flip-chip bonding based on anisotropic conductive adhesive (ACA) has many advantages and is popular in many electronic packaging interconnect products, such as radio frequency identification (RFID), liquid crystal displays (LCDs), and flexible electronics [1]–[3]. Jiang: Study on the Interfacial Residual Stress of Flip-Chip Joints Based on ACA The influence of the structural features of the flip-chip joint on the interfacial residual stress distribution is studied.

Objectives

Results

Conclusion