Abstract
Sputtering rate Sr was proposed as an alternative parameter instead of sputtering yield Y to calibrate the sputtering ability of the target, defined as the mass loss of the target per unit time and sputtering current. The approach is more reliable for glow discharge processes since the intense backscattering effect was taken into consideration. The effects of processing parameters on Sr were investigated through orthogonal test, the results indicated that target temperature affects Sr obviously, and among the discharge parameters, the target voltage and discharge pressure were the governing factors. Through regression analysis, the sputtering rate Sr was expressed as a function of sputtering voltage and discharge pressure which could be used to evaluate or predict the real output of the sputtering target.
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