Abstract
The new technogical process is a kind of green mechanical processing without chip in this paper, the process can form relative deep hole in thin panel by friction heat between the drilling tool and workpiece, and it not only saves material, but also saves man-hours. In the paper, simulated analysis about the influence of different rotate speed and feed speed on the temperature field of forming hole of workpiece, and researched on the influence of processing parameters to recrystallization percent distribution and grain size of the around hole; Finally studied experimentally on the microstructure distribution by FEI Sirion and contrasted analysis the grain size around the hole of different location of test and simulation. The research results show that the simulation results agree well with the actual test results, and the appropriate process parameters are found to form hole under the conditions of this paper. The research results are useful for further optimization of the process in order to produce deep hole workpiece with ideal recryatallization organization.
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