Abstract
High frequency channel loss, reflection, and crosstalk are causing degradation of the receiver eye opening, jitter performance, and bit error rate. The voltage drop and current density wisely affects the performance of the PCB.The increase in current density in turn increases the temperature of the board which might cause fault in performance or even explosion of the device. In addition, improper PCB design can lead to noncompliance with EMC regulations. The physical design changes required to meet the use case conditions negatively impact the signal and power integrity performance, limiting the speeds and capabilities that are achievable. The signal and power integrity desires directly oppose one another, so a holistic platform design approach is required to optimize system performance. Since power integrity affects the entire device, from the chip to the chip package to the board to the entire system, a variety of factors must be considered to ensure the design.
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