Abstract
Stainless steel will become the substrate material of the flexible display, requirements of the flexible substrate in the surface quality and performance are very strict. Chemical mechanical polishing (CMP) is one of the most appropriate technologies to achieve the surface processing of ultra-thin stainless-steel flexible display substrate with ultra-smooth and damage-free. In this paper, the design of CMP slurry of 304 stainless steel on the hydrogen peroxide-oxalic acid type was proposed. Through experiment and analysis, the basic ingredients of CMP slurry was obtained. The research results showed that the hydrogen peroxide can increase the hydrophilicity of the stainless steel surface, and the Fenton type Haber-Weiss reaction can occur on the surface of the fresh metal substrate of stainless steel. The trivalent iron ions generated by the Fenton type reaction combined with oxygen to generate iron oxide and promoted the removal of the surface material. Under acidic conditions, the oxalic acid can decrease the stability of the oxide film on the stainless steel surface, promote the diffusion of oxygen into the metal interface, improve the oxygen reduction reaction, and increase the material removal rate. The results will provide an important reference for the next researching the CMP slurry of 304 stainless steel.
Highlights
Flexible display with ultra-thin, light weight, durable, large storage capacity, design freedom, flexible, winding and impact resistance and other properties [1,2], will become an important goal for the future development of display technology and widely used in industrial, civilian and military industries [3,4]
Flexible display is a flexible material as substrate, the requirements on the surface quality and properties of the flexible substrate are very strict, the surface roughness must be less than 5 nm, waviness is less than 0.1 microns, high thermal stability, light weight, high strength thin, high flexibility and toughness, etc., the stainless steel material cost is low, will become the main future flexible large size display substrate materials[8,9]
According to the results of the previous polishing slurry test and the material characteristics of 304 stainless steel, white corundum was selected as the abrasive for the polishing experiment, sodium native phosphate was selected as the dispersant, oxalic acid was used as the pH regulator, and hydrogen peroxide was used as the oxidant
Summary
Flexible display with ultra-thin, light weight, durable, large storage capacity, design freedom, flexible, winding and impact resistance and other properties [1,2], will become an important goal for the future development of display technology and widely used in industrial, civilian and military industries [3,4]. The biggest problem of stainless steel as the substrate of flexible display is that the surface roughness is too large, which requires ultra-precision polishing of its surface. Chemical mechanical polishing (CMP) technology is considered to be the best process method that can meet both surface roughness and surface smoothness requirements. Chemical mechanical polishing technology is probably the most suitable and fully applicable for highefficiency ultra-precision machining of large ultra-thin stainless-steel flexible display substrate surfaces to obtain ultra-smooth and non-damaged machining surfaces. According to the results of the previous polishing slurry test and the material characteristics of 304 stainless steel, white corundum was selected as the abrasive for the polishing experiment, sodium native phosphate was selected as the dispersant, oxalic acid was used as the pH regulator, and hydrogen peroxide was used as the oxidant. The total volume of the polishing slurry was 250ml for the each chemical mechanical polishing experiment
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