Abstract

SILC has become more serious due to the aggressive scaling-down of the gate oxide thickness. In this paper, we investigate the near-flatband-voltage (NFB) SILC for both NMOS and PMOS with an EOT of 15A plasma nitrided gate oxide. The noticeable evolution of NFB SILC was observed. The generation kinetics of NFB SILC demonstrated the relationship with the density of stress-induced interface trap and the concentration of nitrogen incorporation near Si/SiO/sub 2/ interface. The NFB SILC behavior of RTNO (rapid thermal oxynitride) and plasma nitrided oxide was compared in this paper.

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