Study on Nanoparticle Agglomeration During Chemical Mechanical Polishing (CMP) Performance

Abstract

The materials used in base fluids and nanoparticles are varied. One- and two-step manufacturing processes are used to create stable and highly conductive nanofluids. Both methods for making nanoparticle suspensions suffer from nanoparticle agglomeration, which is a major problem in any technique that uses nanopowders. As a result, the key to substantial surface finishing at planarization treatments and increase in the thermal characteristics of nanofluids is the production and suspension of almost non-agglomerated or monodispersed nanoparticles in liquids. This unfavorable aggregation is a major problem in nanopowder technology. Primary material constituents agglomerate rapidly overcoming the stable situation, and nanoparticle agglomerates set out in liquids, making it difficult to create nanofluids using two-step techniques. This research looks at the link between nanoparticle agglomeration during slurry flow and Material Removal Rate (MRR) during chemical mechanical polishing (CMP). The reciprocal relationship between MRR and the shear force exerted by the slurry flow was qualitatively elucidated by the researchers for the theoretical investigation. However, the present manipulation is focused on quantifying the shear stress exerted by nanoparticles floating in the slurry. As a result, the MRR-aggregation model is established based on the relationship between MRR and shear force. The experiment is being carried out to support this idea. The experimental results of aggregation and shear forces have been conducted by some recent studies. However, the extension to the real CMP is very promising for accomplishing a precise style of the removal mechanism and surface finishing criterion as well.