Study of the polishing slurry dispersant for chemical mechanical polishing of 304 stainless steel

Abstract

To further clarify the effect of the polishing slurry dispersant on the chemical mechanical polishing (CMP) performance of 304 stainless steel, a series of tests were carried out. The correlation between the material removal rate (MRR), surface roughness of 304 stainless steel, dispersant composition, and their content was investigated under two kinds of polishing slurry (hydrogen peroxide oxidant and ferric chloride oxidant) conditions. The experimental results indicated that the MRR and surface roughness of 304 stainless steel arrived at the maximum when the content of sodium hexametaphosphate dispersant was 1.2% (wt) under the hydrogen peroxide–oxalic acid polishing slurry condition. The values of MRR and surface roughness were 146 nm/min and 10 nm, respectively. The MRR and surface roughness of 304 stainless also reached the maximum value as the content of the propanetriol dispersant was 1.2% (wt) under the ferric chloride–oxalic acid polishing slurry condition. However, the values of MRR and surface roughness were 457 nm/min and 22 nm, respectively. Therefore, sodium hexametaphosphate was recommended as the dispersant of hydrogen peroxide–oxalic acid polishing, and propanetriol was recommended as the dispersant of ferric chloride–oxalic acid polishing slurry condition, according to the above analysis. This study lays a theoretical foundation for the improvement of 304 stainless steel CMP performance.