Abstract
The chip is the core component of the integrated circuit. Degradation and failure of chip solder joints can directly lead to function loss of the integrated circuit. In order to establish the degradation model of chip solder joints under coupled stress, this paper takes quad flat package (QFP) chip solder joints as the study object. First, solder joint degradation data and failure samples were obtained through fatigue tests under coupled stress. Three types of micro failure modes of solder joints were obtained by scanning electron microscope (SEM) analysis and finite element model (FEM) simulation results. Second, the characterization of degradation data was obtained by the principal component of Mahalanobis distance (PCMD) algorithm. It is found that solder joint degradation is divided into three stages: strain accumulation stage, crack propagation stage, and failure stage. Later, Coffin–Manson model and Paris model were modified based on the PCMD health index and strain simulation. The function relationship between strain accumulation time, crack propagation time, and strain was determined, respectively. Solder joint degradation models at different degradation stage were established. Finally, through strain simulation, the models can predict the strain accumulation time and failure time effectively under each failure mode, and their prediction accuracy is above 85%.
Highlights
With the development of electronic equipment reliability support, traditional time-based maintenance support technology has gradually changed to condition-based maintenance support technology
To establish effective degradation models of chip solder joint is of great significance for predicting the chip fatigue life, as well as the reliability evaluation and condition-based maintenance of integrated circuits
In order to study the relationship between the solder joint status and its mechanical properties, many scholars refer to the classic failure physical model to assess the solder joint health status
Summary
With the development of electronic equipment reliability support, traditional time-based maintenance support technology has gradually changed to condition-based maintenance support technology. Chip solder joints are prone to degradation damage under coupled stress, such as vibration, shock, and temperature conversion [5,6]. To establish effective degradation models of chip solder joint is of great significance for predicting the chip fatigue life, as well as the reliability evaluation and condition-based maintenance of integrated circuits. In terms of solder joint degradation modeling, data-driven and failure physics/physics-of-failure (PoF) methods are widely used [7]. In order to study the relationship between the solder joint status and its mechanical properties, many scholars refer to the classic failure physical model to assess the solder joint health status. According to the failure physical model, the solder joint degradation can be studied from the physical mechanism.
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