Abstract

Electronic packaging solder joints are the key parts of mechanical fixation and electrical interconnection between electronic chips and printed circuit boards, which are prone to failure and lead to electronic device failures under the action of vibration environment stress. In regard to the failure characterization and degradation modeling of electronic packaging solder joints under vibration load, this paper adopts environmental stress tests, builds a vibration failure test platform, designs a vibration load excitation spectrum, and obtains solder joint degradation data under vibration stress; it uses the square root amplitude, form factors, and kurtosis factors to characterize the solder joint degradation process, which effectively identify the solder joint degradation node, and improve the data monotonicity of the solder joint degradation process; the Wiener process is used to build a solder joint multi-stage degradation model. Based on the EM algorithm, the hyperparameters of the degradation model have been optimized, and the universal test of the Wiener degradation model with multiple samples is carried out in accordance with the LB index. The analysis shows that the effectiveness of different samples is as high as 87.5%, which verifies the universality of the Wiener degradation model; Based on the crack morphology subject to the solder joint test and the features of the solder joint in the multi-stages, the paper analyzes the crack propagation behavior of the solder joint, and clarifies the failure mechanism of the solder joint.

Highlights

  • With the continuous expansion and extension of battlefield boundaries in the information age, various types of combat units, mainly aircraft, radar, reactance, and communications, have more diverse functional configurations and complex equipment components

  • This paper focuses on the health characterization and degradation modeling of solder joints under vibration loads

  • The square root amplitude, form factor, and kurtosis factor are used as the characteristics of the solder joint degradation process, which effectively identify the solder joint degradation node and improve the data monotonicity of the solder joint degradation process

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Summary

INTRODUCTION

With the continuous expansion and extension of battlefield boundaries in the information age, various types of combat units, mainly aircraft, radar, reactance, and communications, have more diverse functional configurations and complex equipment components. Since the environmental stress test can directly obtain the state monitoring signal reflecting the failure process of the solder joint, it is more helpful to study the failure characterization and degradation modeling of the solder joint [7], [8]. The paper uses the environmental tests and designs solder joint health monitoring circuits, which obtain electrical signals of solder joint status; the second part includes the multi-dimensional degradation characteristics of solder joints, the construction of a stochastic Wiener process model of solder joints, and testing the adaptability of the model with multi-sample degradation data; in the last part, the paper studies the failure mechanism of solder joints based on the multi-stage degradation statistical characteristics and the microscopic crack morphology of the solder joints. The voltage amplitude of the solder joint changes from 0 to 5V from the initial state to the final failure

RANDOM VIBRATION LOAD DESIGN
OPTIMIZATION OF MODEL PARAMETERS BASED ON THE EM ALGORITHM
ANALYSIS OF MICROSCOPIC FAILURE MECHANISM OF SOLDER JOINTS
Findings
CONCLUSION
Full Text
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