Abstract
Under complex working conditions, solder joints are often subjected to the combined effects of temperature, vibration, humidity, and electrical stress. Under the coupling of multiple stresses, its life is significantly shorter than that of a single stress. Therefore, studying the failure mechanism and acceleration factor calculation method of solder joints under the coupling of multiple stresses is very important to accurately evaluate or predict the life of electronic products in engineering. In order to more accurately predict the product life under the action of multiple stresses, a new method for calculating the acceleration factor of solder joints under the coupling of multiple stresses is proposed in this paper. By studying the failure mechanism of the solder joints of electronic products under a single stress and the interaction of the failure mechanisms under the coupling of two or more stresses, the calculation methods of the solder joint life and acceleration factors under two or more stress couplings are obtained. Taking a circuit board as an example, the acceleration factor of the accelerated test of the interconnection solder joint under the coupling of temperature, humidity, vibration and electrical stress is calculated.
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