Abstract
Embedded capacitor films (ECFs) were newly designed for high dielectric constant and low capacitance tolerance (less than ±5%) embedded capacitor fabrication for organic substrates. ECFs are transferable and B-stage films which can be coated on a releasing film. In terms of materials formulation, ECFs are composed of high dielectric constant BaTiO 3 (BT) powder, specially formulated epoxy resin, and latent curing agent. And in terms of coating process, a roll coating method is used for obtaining film thickness uniformity in a large area. Differential scanning calorimeter (DSC) thermal analysis was conducted to determine the optimum amount of curing agent, curing temperature, and curing time. Changes in the dielectric constant of epoxy/BaTiO 3 composite ECFs with BT particle sizes and contents were investigated. Dielectric constant of 90 was obtained using two different size BaTiO 3 powders mixture. Typically, capacitors of 12 μm thick film with 8 nF/cm 2 with less than ±5% capacitance tolerance and low leakage current (less than 10 −7 A/cm 2 at 10 V) were successfully demonstrated on PCBs using epoxy/BaTiO 3 composite embedded capacitor films.
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