Characteristics of Fine Patterned Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic Substrates

Abstract

In this study, we have demonstrated new patterning method of epoxy/BaTiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> composite ECFs for fine patterning using the combination of reactive ion etching and ultrasonic cleaning. And the effect of patterning processes on the dielectric properties of epoxy/BaTiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> composite ECFs has been also investigated. The capacitance and dielectric loss of the fine patterned ECFs were lower than those of non-patterned ECFs. The dielectric constant and capacitance of patterned ECFs decreased by 10% and dielectric loss by 40% due to thermal history during the etching process. In addition, the pattern size of ECFs has also affected dielectric properties. The dielectric constant slightly increased from 34 to 37 and capacitance tolerance from plusmn5% to plusmn9%, as the pattern size decreased from 4 mm times 4 mm to 1 mm times 1 mm. It was mainly due to the increased tolerance of finer defined electrode areas. The dielectric constant of 37, capacitance of 2.4 nF/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , and capacitance tolerance of plusmn9% was obtained by 1 mm times 1 mm size fine patterned capacitors. As a result, ECFs patterning method using plasma etching and ultrasonic cleaning was successfully demonstrated for fine patterned embedded capacitors.