Abstract
Recently, the eutectic solder alloys have been replaced by the lead-free solder alloys because of the environmental pollution problems. In this study, temperature dependency and strain rate dependency on inelastic deformation behavior of Sn-37 Pb and Sn-3.5 Ag-0.75 Cu solder alloys under tensile loading with sudden change in strain rate are investigated experimentally and theoretically based on the overstress theory. It is found that the Sn-3.5 Ag-0.75 Cu solder alloy shows higher yield stress and the dynamic recovery in work hardening. The overstress constitutive model is found to be useful to predict the inelastic deformation behaviors of eutectic and lead-free solder alloys precisely, including relaxation behavior.
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