Abstract
Recently, the eutectic solder alloys have been replaced by the lead-free solder alloys because of the environmental pollution problems. In this study, temperature dependency and strain rate dependency on plastic behavior of Sn-37Pb and Sn-3.5Ag-0.75Cu solder alloys under biaxial loading with sudden change in strain rate and in stress relaxation at several temperature are investigated experimentally and theoretically based on the overstress theory. The overstress constitutive model is found predict the inelastic deformation behaviors of eutectic and lead-free solder alloys precisely, including relaxation behavior.
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Schedule a callMore From: The Proceedings of the Materials and Mechanics Conference
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