Abstract
The dynamic compressive properties of 96.3 Sn 3 Ag 0.7 Cu and 99.3 Sn 0.7 Cu solders were studied by means of a split Hopkinson pressure bar at strain rates ranging from 500 to 2000 s−1. Tests were conducted at room temperature and under uniaxial compressive conditions. Eutectic SnPb solders were used as the reference. From the data of tests, it was found that yield strength and flow stress increased remarkably with the increase of strain rate. On logarithmic scales, the yield strength increased linearly with strain rate. These lead-free solders revealed certain visco-plastic behavior and strain rate sensitivity, which predicted using Johnson-Cook material model. Related parameters in the model were determined from the experiment. Compared with the typical Pb -containing solder Sn63Pb37 , these lead-free solders showed some fine properties and could substitute some Pb -containing solder alloys in microelectronic components packaging and interconnects.
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