Abstract
In recent years, many lead-free solder alloys begin to replace the Pb-containing solder alloys in microelectronic industry and come into use in some packaging processes and interconnects of certain microelectronic components. The elimination of Pb-containing in consumer microelectronic products has been common understood in the world. The lead-free solder Sn96.5Ag3Cu0.5 was considered as one of candidates which could replace Pb-containing solder in microelectronic packaging and interconnects. In this work, the characteristics of temperature and strain rate of Sn96.5Ag3Cu0.5 were investigated and a group of tensile tests of different temperatures and tensile speeds were conducted. From the data of tests, it was found that temperature and strain rate demonstrated crucial effect on tensile property and creep property. This lead-free solder revealed certain visco-plastic behavior, temperature dependence, strain rate sensitivity and creep resistance. Compared with the typical Pb-containing solder Sn63Pb37, this lead-free solder Sn96.5Ag3Cu0.5 showed some fine properties and this lead-free solder Sn96.5Ag3Cu0.5 could substitute some Pb-containing solder alloys in microelectronic components packaging and interconnects.
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