Study on adhesive reliability of low-temperature sintered high power LED modules

Abstract

Low temperature sintered nano-silver paste becomes a potential alternative in green electrical packaging because of its higher thermal and electrical conductivity than conventional solders. It can be used for connected chips that require high temperature operation, such as high power LED and power electronics modules, etc. During service, alternating shear strain, even thermal fatigue failure will occur due to thermal expansion coefficient mismatch of chip and substrate. Therefore, it is necessary to study the reliability and failure mechanism of low temperature sintered nano-silver joint. In this study, loading-control shear fatigue tests, temperature cycling and hygrothermal aging tests were conducted on sintered nano-silver paste connected LED modules, through which we made an initial exploration on the mechanical reliability and failure mechanism of this new type of interconnection material.