Drop impact simulation and experimental validation on high power light emitting diodes modules

Abstract

Impact behaviors of high-power LED are essential due to the possible poor adhesion of interfaces and should be studied. In this study, the analysis of dynamic response for high-power LED module under impact load is conducted with simplified theoretical analysis, experimental testing and numerical simulation. A self-made microelectronics drop impact tester is established. Then reliability performances of high power LED module subjected to drop test conditions are evaluated experimentally. Good reproducibility dynamic parameters of impact force-time, acceleration-time are recorded for evaluating the impact response through the signal processing. In addition, a theoretical analysis of the impact dynamic progress is conduced, which shows the self-made drop tester is relatively precise by comparing the theoretical and experimental results. The major failure modes of LED module include lens fall off and crack formation in the impact experiment. The numerical simulation is conducted by nonlinear FEA software ABAQUS for high-power LED drop impact process under different drop angle conditions. Because the drop impact is a transient dynamic process, the constitutive relations of solder material under high strain rate are taken into consideration. The purpose of numerical simulation is to obtain the distribution of local stress and deformation under drop impact process, which is significant for comprehensive and in-depth understanding for high-power LED module drop impact response.