Abstract
The chemical part of adhesion is studied at epoxy-copper interfaces. This is realized by creating epoxy surfaces with constant surface roughness by means of wet chemical pretreatments (sweller and oxidizer). These roughened epoxy surfaces are chemically transformed by nucleofilic substitutions using an anchoring molecule, 2-mercaptopyrimidine and glycerol. Cu is deposited by an electroless and electroplating scheme, followed by patterning. After patterning peel strengths are measured. The peeled epoxy surface and the backsides of the peeled Cu-strips are examined by means of XPS. These experiments are used to determine the influence of the interface atomic composition on the locus of failure during peeling.
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