Abstract
The binary lead-free solder alloy Sn–Zn9 was considered as a potential alternative to lead–tin solder alloys, when compared with other solders. In this paper, the effects of the addition of Ag, Bi, Cu and Sb on structure, melting temperature, wettability and electrical resistivity for this rapidly solidified alloy have been investigated. The results showed that a new phase Ag5Zn8 appeared, in addition to the formation of Ag3Sn and Ag4Sn for the alloy Sn–Zn9–Ag1, and that the intermetallic compound Cu5Zn8 appeared in the case of Sn–Zn9–Cu1. Also, the alloy Sn–Zn9–Bi1 has better properties for use as solder such as low melting point, lower electrical resistivity and lower temperature coefficient of resistivity and adequate wetting.
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