Abstract
Structure, electrical resistivity, wettability, melting point, internal friction and elastic moduli of the Sn50In50, Sn77.2In20Ag2.8, Sn72.5In25Ag2.5 and Sn95Ag5 rapidly solidified lead-free solder alloys have been investigated. The Sn50In50 alloy has better properties such as low strength, melting point, electrical resistivity and adequate wetting for low-temperature solder applications (precious metals) and bearing solder when soldering to gold substrate. In addition, it has better rework/repair characteristics. The electrical resistivity, internal friction and wetting values decrease by adding silver to tin-indium alloys but the melting temperature and elastic modulus values are increased. The Sn95Ag5 lead-free solder alloy has better properties, such as higher values of melting point and elastic modulus as compared with lead-tin eutectic solder alloy, for high-temperature solder applications.
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