Abstract
The high-speed switching capabilities of wide bandgap (WBG) power devices have posed challenges in accurately evaluating their dynamic characteristics, primarily due to the increasing influence of parasitic components in switching test circuits. To address this issue, we investigated the impact of parasitics by conducting dynamic tests and schematic-level transient simulation on a half-bridge switching circuit incorporating SiC MOSFETs. This comparative analysis identified specific parasitic components responsible for undesirable behaviors such as spikes and ringing in the switching waveform. Our findings provide insights into which parasitic components in the test circuit are critical for the accurate dynamic characterization of SiC MOSFETs.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
