Study of multilayer packaging delamination mechanisms using different surface analysis techniques

Abstract

Multilayer packaging, consisting of different layers joined by using an adhesive or an extrusion process, is widely used to promote different products, such as food, cosmetics, etc. The main disadvantage in using this form of packaging is the delamination process. In this work, different surface techniques (X-ray photoelectron spectroscopy, time-of-flight secondary ion mass spectroscopy and attenuated total reflection Fourier transform infrared spectroscopy) are used to analyse the delaminated surfaces in order to study the mechanisms that cause delamination of multilayer packaging. According to our results, the reaction of migrated molecules with adhesive-aluminium bonds is the main cause of the chemical delamination process. In contrast, the delamination of extruded materials would seem to be caused by the breaking of Van der Waals bonds.