Abstract

Laser cladding is becoming an attractive process for the repair and hardfacing of high-value components. The consumables used for these cladding processes are usually metallic powders due to the ease of operation. However, the use of metal powder is generally limited to downhand position cladding process. Wire can also be used in laser cladding process and can be fed directly into the laser beam when operating out-of-position. However, deposit thickness and dilution with the work piece can be difficult to control. This work has investigated aspects of the wire cladding process and how the level of dilution may be controlled. The effects of using a laser beam at a low angle of incidence to the plate are also described.Results of the study show that the dilution of the wire clad can be controlled by manipulating the wire feed in relation to the travel direction. It has been further observed that in order to maintain the effective melting and deposition of the overlay the position of the wire tip needs to be adjusted as the incident angle of the laser is decreased.Laser cladding is becoming an attractive process for the repair and hardfacing of high-value components. The consumables used for these cladding processes are usually metallic powders due to the ease of operation. However, the use of metal powder is generally limited to downhand position cladding process. Wire can also be used in laser cladding process and can be fed directly into the laser beam when operating out-of-position. However, deposit thickness and dilution with the work piece can be difficult to control. This work has investigated aspects of the wire cladding process and how the level of dilution may be controlled. The effects of using a laser beam at a low angle of incidence to the plate are also described.Results of the study show that the dilution of the wire clad can be controlled by manipulating the wire feed in relation to the travel direction. It has been further observed that in order to maintain the effective melting and deposition of the overlay the position of the wire tip needs to be...

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