Abstract

Infrared reflection absorption spectroscopy has been used to study the chemisorption of fluorine (by exposure to XeF2) on polycrystalline Si surfaces in ultrahigh vacuum and under low-pressure steady-state conditions. Adsorption at 300 K leads to the sequential formation of mono-, di-, and trifluoride SiFx groups. Annealing at successively higher temperature forms more ≡SiF by decomposition of =SiF2 and –SiF3. After a 770 K anneal, only the 890 cm−1 ≡SiF band remains and is removed by F desorption at ∼820 K. Similar results are obtained in a continuous XeF2 flux with, in addition, the appearance near 300 K of a weak feature possibly due to adsorbed SiF4. Based in part on these results, an estimate can be made of the rate-limiting step in the reaction. In the high-temperature limit (T≥650 K) it appears to be the conversion of ≡SiF to =SiF2; whereas, near 300 K, it is the formation of SiF4 from –SiF3. The effects on fluorination of pre- and postexposure to O2 have also been observed. Preadsorbed O stabilizes F, shifting the F desorption temperature higher by at least 100 K. In the presence of coadsorbed F, the Si–O–Si antisymmetric stretch appears at 1150 cm−1, significantly higher than on a similar, F-free surface. Preadsorbed F impedes subsequent chemisorption of O2, and the O that is adsorbed has no apparent effect on SiFx bonding as reflected in the Si–F stretching vibrations.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call